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Tinning flux for electronics12/7/2023 IEC TS 62647-4 may be used for the replacement of BGA spheres. Replacement of BGA spheres or CGA columns is not included in the scope of this standard. It applies to refinishing performed by a robotic hot solder dip service supplier or production facilities at the customer, whenever the intent of the dipping is to have full coverage and replacement of Pb-free tin. GEIA-STD-0006 does not apply to component manufacturers who originally build components with a hot solder dip finish. This standard covers process and testing requirements for a robotic dipping process and does not cover semi-automatic or purely manual dipping processes. Of pure tin, and Pb-free tin alloy finishes with SnPb finishes with the intent of subsequent assembly with SnPb solder. Requirements for qualifying and testing the refinished components are also included. GEIA-STD-0006 defines the requirements for fully replacing undesirable surface finishes using robotic hot solder dip. ![]() ![]() ![]() Note: For detailed information, refer to GEIA-STD-0006 Requirements for Using Robotic Hot Solder Dip to Replace the Finish on Electronic Piece Parts. Certain electronic component package styles may not lend themselves to robotic hot solder dipping and may require alternative processing. Manual dipping required for full finish replacement is different than manual dipping currently practiced for meeting solderability requirements because of the increased need for 100% coverage all the way to the component body to prevent whisker growth. Greater variation in the process may cause a higher chance of damage, including latent reliability problems. Semi-automatic or purely manual solder dipping processes may not be capable of completely controlling the rates of immersion and emersion of the component terminations and only provide approximate dwell dipping times in the solder bath. Replacement finishes other than SnPb should be evaluated for tin whisker mitigation prior to implementation.Ĭaution: Due to the need to completely control the rates of immersion and emersion of the component terminations and the dwell times in and between each process step, robotic hot solder dip is recommended for electronic component tinning. The guides in section 10 may also be applicable to other component lead finish changes. These guides cover the replacement of pure tin and Pb-free tin alloy finishes with tin-lead (SnPb) finishes for subsequent assembly with tin-lead solder. To decrease the possibility of failure of the electronic components after being solder dipped and to ensure a quality process is performed each time, requirements for performing robotic hot solder dipping are included in section 10. To avoid these concerns, the solder dip process needs to be qualified and carefully controlled. ![]() In addition, the fluxes used during the dipping process can become trapped in minor delamination, like that commonly found in plastic piece parts, which can lead to reliability issues. During solder dip, the piece part experiences temperature differences significantly greater than those present during typical board-level assembly. Solder dip for tin-whisker mitigation differs from solder dip for solderability in that for tin whisker mitigation the termination needs to be coated over its entire length, right up to the package surface. There are two major reasons to solder dip electronic components: solderability concerns and tin whisker mitigation. The guides in section 10 cover the requirements for using manual tinning and robotic hot solder dip to replace the finish on various types of electronic components. During this video demonstration, the solder pot shroud and nitrogen inerting was removed to clearly show the tinning process. The above video demonstrates tinning on SOIC type components. To view this video please enable JavaScript, and consider upgrading to a web browser that supports HTML5 video.
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